Dimensity 9400 Rumored To Be More Expensive, Likely Due To Adoption Of Second-Generation 3nm Process, Tipster Hints Various Improvements Of SoC Too

TSMC’s second-generation 3nm process reportedly used to mass produce MediaTek’s Dimensity 9400 will introduce various improvements, but it will be at the cost of the chipset’s increased price. One tipster notes this change but also reminds viewers that there will be several upgrades to look forward to later this year, so let us see what perks MediaTek’s partners will experience when they get to try out the Dimensity 9400 in their flagships.

Biggest improvement arriving to the Dimensity 9400 is NPU performance; tipster claims that it will increase by 40 percent compared to the previous-generation release

Tipster Digital Chat Station did not mention the exact price increase, but he states in his Weibo post that upcoming flagships like the Vivo X200 will be more expensive than earlier releases. Fortunately, there will be various advantages to incorporating the Dimensity 9400 in smartphones, with additional details mentioning that the SoC introduces power efficiency and AI performance upgrades, with the silicon’s Neural Processing Unit (NPU) said to be 40 percent faster than the Dimensity 9300.

Strangely enough, the tipster did not mention the Dimensity 9400’s raw performance, hinting that there might not be a noteworthy difference between it and its predecessor. However, that is difficult to believe, as the Dimensity 9400 is rumored to lack any efficiency cores, relying on performance cores that should significantly increase single-core and multi-core scores. ARM’s ‘BlackHawk’ CPU architecture will reportedly be adopted for the chipset, but we have to see if there will be any real-world benefit to using such cores.

The Dimensity 9400 is also rumored to feature a significant die size increase, with earlier details stating a measurement of 150mm² and boasting 30 billion transistors, resulting in a bigger cache and upgraded Neural Processing Unit. In short, MediaTek could release the world’s largest smartphone silicon in physical size, which is another reason why it could be expensive to produce.

However, the Taiwanese firm’s CEO Rick Tsai previously expressed confidence in the Dimensity 9400, believing that its launch could help the company post a 50 percent annual revenue increase, while mentioning an unveiling in October. The Chief Executive’s remarks indicate that the Dimensity 9400 could be priced competitively to undercut Qualcomm’s Snapdragon 8 Gen 4, which is already said to be more expensive than the Snapdragon 8 Gen 3, forcing smartphone manufacturers to mull a long-term partnership with MediaTek.

Of course, we should remind readers to treat this information with a pinch of salt and wait for future analysis to form an impartial overview of the Dimensity 9400. Regardless, it will be an exciting few months down the road, so stay tuned for more updates.

News Source: Digital Chat Station